Daniel Lewis

Contact & Personal Information

 

Phone: 518.276.2297

Fax: 518.276.8554

Email: lewisd2@rpi.edu

Mailing Address:
Materials Research Center
rm: 110
110 8th Street
Troy, New York
12180

Daniel Lewis's homepage

Prior to joining Rensselaer, Dr. Lewis was a researcher at GE Global Research. His work focused on oxidation performance and deformation processing of advanced ferritic materials for SOFC interconnects. In addition, he studied the metallurgy and electrical properties of amorphous and nano-crystalline soft magnetic materials, oxidation resistant coatings for superalloys, and infrared heating technology development.

Prior to joining GE Global Research, he was awarded a two-year National Research Council post-doctoral fellowship. Under this award, he worked at the National Institute of Standards and Technology (NIST) to study eutectic solidification microstructures using experimental and computational techniques. While at NIST he co-developed a technique for quantifying solidification microstructures in ternary eutectics. He also studied the effect of solidification velocity on the phase distribution in low-volume fraction ternary eutectics containing intermetallic phases. His computational work involved constructing multi-phase field models for predicting eutectic morphology through lamellar fault motion, phase instabilities, and branching phenomena.

He is a member of TMS and ASM and is currently serving on the TMS Solidification Committee as the publication advisor and vice-chairman. He is also the chairman of the local Hudson-Mohawk TMS Chapter. He has written or co-authored 9 technical articles and has 3 patent applications.