David J. Duquette
John Tod Horton Distinguished Professor in Materials Engineering
Contact & Personal Information
Phone: (518) 276-6490
Fax: (518) 276-8554
Email: duqued@rpi.edu 
Mailing Address:
Materials Research Center
rm: 102
110 8th Street
Troy, New York
12180
Research Center Affiliations
The Center for Advanced Interconnect Systems Technologies
Rensselaer Nanotechnology Center
Center for Integrated Electronics
Education
Ph.D., Massachusetts Institute of Technology
Metallurgy and Materials Science
B.S., United States Coast Guard Academy
Engineering
Professional Background
Professor Duquette received his Ph.D. in metallury and materials science from the Massachusetts Institute of Technology in 1968. Following his graduate work, he performed research on elevated temperature materials at the Advanced Materials Research and Deelopment Laboratory of Pratt and Whitney Aircraft, joining the Rensselaer faculty in 1970. He is the author or co-author of more than 160 scientific publications, primarily in the areas of environmental degradation of materials and electrochemical processing of semiconductor interconnects.
Research
Metallurgy
Materials IT
Integrated Electronics
Materials for Microelectronic Systems
Electronic Materials
Microelectronics Technology
Advanced Materials
Nanotechnology
Semiconductors
Research Bio
Physical, chemical, and mechanical properties of metals and alloys, with special reference to studies of environmental interactions and semiconductor device microfabrication processes: aqueous and elevated temperature corrosion, chemical mechanical planarization, and electrodeposition of microdevice wiring
Awards
- Listed in Who's Who in America
- Fellow, Electrochemical Society
- Fellow, American Society for Metals
Dr. Duquette is a recipient of the Whitney Award of the National Association of Corrosion Engineers for his contributions to corrosion science, honorary membership in Alpaha Sigma Mu, and an Alexander von Humboldt Senior Scientist Award. He is a Fellow of ASM International, The Electrochemical Society, and of NACE International. In 2000 her was the receipient of the Distinguished Career Award, Hudson-Mohawk Section of TMS. In 2002 he was named to the United States Nuclear Waste Technology Review Board by President George W. Bush.
Publications
- Direct plating of Cu on Pd Plasma Enhanced Atomic layer deposition Coated TaN (2007)
Type: Article
Topic: Integrated Electronics - Morphology control of Copper Growth on TaN Diffusion Barriers in Seedless Copper Electrodeposition (2007)
Type: Article
Topic: Integrated Electronics - Quantitative measurement of interfacial Adhesion Between Seedless Electrodeposited Copper and Tantalum Based Diffusion Barriers for Microelectronics (2007)
Type: Article
Topic: Integrated Electronics - Seedless copper Electrochemical deposition on Air-Exposed TaN Barrier Layers with Pd and Ru Adhesion Promoters (2007)
Type: Article
Topic: Integrated Electronics - Fretting Fatigue in 2XXX Series Aerospace Aluminium Alloys (2006)
Type: Article
Topic: Tribology
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Marcia Hartnett, Administrative Assistant
Phone: (518) 276-6941
Email: hartnm2@rpi.edu
Mailing Address:
Jonsson Engineering Center
rm: 4049
110 8th Street
Troy, New York
12180